KB PI-515G，環(huán)氧覆銅無(wú)鹵素板(FR4)采用優(yōu)質(zhì)玻璃纖維布及環(huán)氧樹(shù)脂經(jīng)無(wú)鹵工藝壓制而成,KB PI-515G TG150 同時(shí)不含鹵素,不含銻,不含紅磷,應(yīng)用在環(huán)保要求較高的產(chǎn)品上.

特性：

●?無(wú)鹵,無(wú)銻,無(wú)紅磷,Tg190℃  Halogen,antimony and red phosphorous free Tg190℃ 

●?優(yōu)良的耐熱性 Excellent thermal reliability

●?低的Z軸熱膨脹系數(shù) Low Z-CTE

● 良好的耐CAF性能 Ati-CAF capability

●?符合IPC-4101B的規(guī)范要求?IPC-4101B?specification?is?applicable

應(yīng)用領(lǐng)域：

●高端服務(wù)器 High-end Server

●背板 Backpanel

●無(wú)線通信設(shè)施 Wireless communication infrastructure

●高復(fù)雜度多層板 High complexity multi-layers

●高耐熱汽車(chē)板 Automotive applications requiring highthermal resistance

                            性能參數(shù)表